DEVICE AND METHOD FOR INSPECTING IMAGE DEFECT
PROBLEM TO BE SOLVED: To reduce lowering of inspection efficiency which results from scanning these basic patterns in the same direction, when picking up a plurality of basic patterns not running in the main scanning direction, by performing two-dimensional scanning with an imaging unit over a sampl...
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| creator | KAMIYAMA SHINJI |
| description | PROBLEM TO BE SOLVED: To reduce lowering of inspection efficiency which results from scanning these basic patterns in the same direction, when picking up a plurality of basic patterns not running in the main scanning direction, by performing two-dimensional scanning with an imaging unit over a sample in which the same basic pattern is repeatedly formed in two-dimensional direction, and comparing between an inspection image being an image picked up from one of these basic patterns and a reference image obtained from an image picked up from another basic pattern. SOLUTION: The inspection method includes: relatively moving a sample and an imaging unit so that two successive main scans may be performed in mutually opposite directions; storing reference images in predetermined memory circuits (21a, 21b) so that the reference images obtained from the main scanning, performed in opposite directions each other, is stored in different memory areas; and comparing an inspection image obtained from a main scan with a reference image obtained from another main scanning, performed previously directed in the same direction. COPYRIGHT: (C)2009,JPO&INPIT |
| format | Patent |
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SOLUTION: The inspection method includes: relatively moving a sample and an imaging unit so that two successive main scans may be performed in mutually opposite directions; storing reference images in predetermined memory circuits (21a, 21b) so that the reference images obtained from the main scanning, performed in opposite directions each other, is stored in different memory areas; and comparing an inspection image obtained from a main scan with a reference image obtained from another main scanning, performed previously directed in the same direction. 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SOLUTION: The inspection method includes: relatively moving a sample and an imaging unit so that two successive main scans may be performed in mutually opposite directions; storing reference images in predetermined memory circuits (21a, 21b) so that the reference images obtained from the main scanning, performed in opposite directions each other, is stored in different memory areas; and comparing an inspection image obtained from a main scan with a reference image obtained from another main scanning, performed previously directed in the same direction. 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SOLUTION: The inspection method includes: relatively moving a sample and an imaging unit so that two successive main scans may be performed in mutually opposite directions; storing reference images in predetermined memory circuits (21a, 21b) so that the reference images obtained from the main scanning, performed in opposite directions each other, is stored in different memory areas; and comparing an inspection image obtained from a main scan with a reference image obtained from another main scanning, performed previously directed in the same direction. COPYRIGHT: (C)2009,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | DEVICE AND METHOD FOR INSPECTING IMAGE DEFECT |
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