CLEANING AGENT FOR REMOVING SOLDER FLUX AND METHOD FOR CLEANING SOLDER FLUX
PROBLEM TO BE SOLVED: To provide a cleaning agent for removing the solder flux which exhibits the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property even in t...
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| creator | FURUI HIROHIKO HORI SHIGEO TAKAHASHI HISAKAZU NAKATSUKA HIROKI |
| description | PROBLEM TO BE SOLVED: To provide a cleaning agent for removing the solder flux which exhibits the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property even in the rinsing using an alcoholic solvent in a next step, and to provide a method for cleaning the solder flux. SOLUTION: The present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 wt.% and a content of amino alcohol to a value which falls within a range of 0.1 to 30 wt.% when a content of a glycol compound is below 1 wt.% The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like. COPYRIGHT: (C)2009,JPO&INPIT |
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SOLUTION: The present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 wt.% and a content of amino alcohol to a value which falls within a range of 0.1 to 30 wt.% when a content of a glycol compound is below 1 wt.% The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like. 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SOLUTION: The present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 wt.% and a content of amino alcohol to a value which falls within a range of 0.1 to 30 wt.% when a content of a glycol compound is below 1 wt.% The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like. 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SOLUTION: The present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 wt.% and a content of amino alcohol to a value which falls within a range of 0.1 to 30 wt.% when a content of a glycol compound is below 1 wt.% The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like. COPYRIGHT: (C)2009,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES CANDLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CLEANING CLEANING IN GENERAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DETERGENT COMPOSITIONS DETERGENTS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL PRINTED CIRCUITS RECOVERY OF GLYCEROL RESIN SOAPS SOAP OR SOAP-MAKING SOLDERING OR UNSOLDERING TRANSPORTING USE OF SINGLE SUBSTANCES AS DETERGENTS WELDING WORKING BY LASER BEAM |
| title | CLEANING AGENT FOR REMOVING SOLDER FLUX AND METHOD FOR CLEANING SOLDER FLUX |
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