LED CHIP
PROBLEM TO BE SOLVED: To provide an LED chip which is used for an LED disposed on the end face of a light guide plate in a sidelight type backlight device, and which makes the light guide plate emit light with uniform luminance and color by improving the luminance unevenness and color unevenness. SO...
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creator | HORIUCHI TOSHIRO KUBOTA KOSUKE MINEMATSU HIROMASA WAKABAYASHI SHINICHI |
description | PROBLEM TO BE SOLVED: To provide an LED chip which is used for an LED disposed on the end face of a light guide plate in a sidelight type backlight device, and which makes the light guide plate emit light with uniform luminance and color by improving the luminance unevenness and color unevenness. SOLUTION: This LED chip 100 is used for the LED 200, disposed facing the side-end face 12 of the light guide plate 10. The LED chip is disposed on the inner bottom face of a recessed part 210a, facing the side end face 12 to emit blue visible light and is sealed by a phosphor which emits yellow-based visible light by being excited by the blue visible light in the recessed part 210a. A transparent resin layer 120, formed into a layer shape provided by protruding from a region, including the center portion in a direction corresponding to the thickness direction of the light guide plate 10 to pass visible light is provided on the light-emitting surface 112 of the chip body 110 which emits blue visible light. As a result, when it is used for the LED 200, a quantity of blue visible light emitted to the side end face 12, while the light passes through the phosphor 230 is set so that the center in the thickness direction of the light guide plate can emit the most. COPYRIGHT: (C)2009,JPO&INPIT |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2009182153A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2009182153A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2009182153A3</originalsourceid><addsrcrecordid>eNrjZODwcXVRcPbwDOBhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBpaGFkaGpsaOxkQpAgBBHxt6</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LED CHIP</title><source>esp@cenet</source><creator>HORIUCHI TOSHIRO ; KUBOTA KOSUKE ; MINEMATSU HIROMASA ; WAKABAYASHI SHINICHI</creator><creatorcontrib>HORIUCHI TOSHIRO ; KUBOTA KOSUKE ; MINEMATSU HIROMASA ; WAKABAYASHI SHINICHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an LED chip which is used for an LED disposed on the end face of a light guide plate in a sidelight type backlight device, and which makes the light guide plate emit light with uniform luminance and color by improving the luminance unevenness and color unevenness. SOLUTION: This LED chip 100 is used for the LED 200, disposed facing the side-end face 12 of the light guide plate 10. The LED chip is disposed on the inner bottom face of a recessed part 210a, facing the side end face 12 to emit blue visible light and is sealed by a phosphor which emits yellow-based visible light by being excited by the blue visible light in the recessed part 210a. A transparent resin layer 120, formed into a layer shape provided by protruding from a region, including the center portion in a direction corresponding to the thickness direction of the light guide plate 10 to pass visible light is provided on the light-emitting surface 112 of the chip body 110 which emits blue visible light. As a result, when it is used for the LED 200, a quantity of blue visible light emitted to the side end face 12, while the light passes through the phosphor 230 is set so that the center in the thickness direction of the light guide plate can emit the most. COPYRIGHT: (C)2009,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090813&DB=EPODOC&CC=JP&NR=2009182153A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090813&DB=EPODOC&CC=JP&NR=2009182153A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HORIUCHI TOSHIRO</creatorcontrib><creatorcontrib>KUBOTA KOSUKE</creatorcontrib><creatorcontrib>MINEMATSU HIROMASA</creatorcontrib><creatorcontrib>WAKABAYASHI SHINICHI</creatorcontrib><title>LED CHIP</title><description>PROBLEM TO BE SOLVED: To provide an LED chip which is used for an LED disposed on the end face of a light guide plate in a sidelight type backlight device, and which makes the light guide plate emit light with uniform luminance and color by improving the luminance unevenness and color unevenness. SOLUTION: This LED chip 100 is used for the LED 200, disposed facing the side-end face 12 of the light guide plate 10. The LED chip is disposed on the inner bottom face of a recessed part 210a, facing the side end face 12 to emit blue visible light and is sealed by a phosphor which emits yellow-based visible light by being excited by the blue visible light in the recessed part 210a. A transparent resin layer 120, formed into a layer shape provided by protruding from a region, including the center portion in a direction corresponding to the thickness direction of the light guide plate 10 to pass visible light is provided on the light-emitting surface 112 of the chip body 110 which emits blue visible light. As a result, when it is used for the LED 200, a quantity of blue visible light emitted to the side end face 12, while the light passes through the phosphor 230 is set so that the center in the thickness direction of the light guide plate can emit the most. COPYRIGHT: (C)2009,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZODwcXVRcPbwDOBhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBpaGFkaGpsaOxkQpAgBBHxt6</recordid><startdate>20090813</startdate><enddate>20090813</enddate><creator>HORIUCHI TOSHIRO</creator><creator>KUBOTA KOSUKE</creator><creator>MINEMATSU HIROMASA</creator><creator>WAKABAYASHI SHINICHI</creator><scope>EVB</scope></search><sort><creationdate>20090813</creationdate><title>LED CHIP</title><author>HORIUCHI TOSHIRO ; KUBOTA KOSUKE ; MINEMATSU HIROMASA ; WAKABAYASHI SHINICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2009182153A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HORIUCHI TOSHIRO</creatorcontrib><creatorcontrib>KUBOTA KOSUKE</creatorcontrib><creatorcontrib>MINEMATSU HIROMASA</creatorcontrib><creatorcontrib>WAKABAYASHI SHINICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HORIUCHI TOSHIRO</au><au>KUBOTA KOSUKE</au><au>MINEMATSU HIROMASA</au><au>WAKABAYASHI SHINICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LED CHIP</title><date>2009-08-13</date><risdate>2009</risdate><abstract>PROBLEM TO BE SOLVED: To provide an LED chip which is used for an LED disposed on the end face of a light guide plate in a sidelight type backlight device, and which makes the light guide plate emit light with uniform luminance and color by improving the luminance unevenness and color unevenness. SOLUTION: This LED chip 100 is used for the LED 200, disposed facing the side-end face 12 of the light guide plate 10. The LED chip is disposed on the inner bottom face of a recessed part 210a, facing the side end face 12 to emit blue visible light and is sealed by a phosphor which emits yellow-based visible light by being excited by the blue visible light in the recessed part 210a. A transparent resin layer 120, formed into a layer shape provided by protruding from a region, including the center portion in a direction corresponding to the thickness direction of the light guide plate 10 to pass visible light is provided on the light-emitting surface 112 of the chip body 110 which emits blue visible light. As a result, when it is used for the LED 200, a quantity of blue visible light emitted to the side end face 12, while the light passes through the phosphor 230 is set so that the center in the thickness direction of the light guide plate can emit the most. COPYRIGHT: (C)2009,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | LED CHIP |
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