IC WAFER AND IC CHIP DIVIDED INDIVIDUALLY

PROBLEM TO BE SOLVED: To provide an IC wafer and IC chip with an enhanced bonding strength of a metal bump with respect to an IC terminal. SOLUTION: In the IC wafer divided into individual IC chips 1 with an IC terminal 5 on one main face, the IC terminal 5 is configured to have a dummy terminal for...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ISHIMARU CHISATO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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