SOLID IMAGING APPARATUS, METHOD FOR MANUFACTURING SOLID IMAGING APPARATUS AND PHOTOGRAPHING DEVICE USING SOLID IMAGING APPARATUS

PROBLEM TO BE SOLVED: To provide a miniaturized, thinner, and reliable solid imaging apparatus. SOLUTION: The solid imaging apparatus includes a sensor chip 3, a lens 4, a transparent substrate 5 and a spacer 11A. Sealing resin 6 covers the sensor chip 3 and the transparent substrate 5 disposed to f...

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Bibliographische Detailangaben
Hauptverfasser:	MINAMIDE AKIZO, MIKI RENZABURO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a miniaturized, thinner, and reliable solid imaging apparatus. SOLUTION: The solid imaging apparatus includes a sensor chip 3, a lens 4, a transparent substrate 5 and a spacer 11A. Sealing resin 6 covers the sensor chip 3 and the transparent substrate 5 disposed to face at an effective pixel area 3a on the sensor chip 3. The spacer 11A for preventing the lens 4 from peeling off is arranged on the sealing resin 6 so as to enclose the transparent substrate 5. The lens 4 is formed on the transparent substrate 5. A part of the lens 4 protruded from the transparent substrate 5 is formed on the spacer 11A. COPYRIGHT: (C)2009,JPO&INPIT