SUBSTRATE FOR SEMICONDUCTOR DEVICE, RESIN-SEALED SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE SUBSTRATE, AND METHOD OF MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing sufficiently miniaturizing a semiconductor device substrate and a resin-sealed semiconductor device in the plane direction. SOLUTION: The semiconductor device substrate 10 includes a substrate 1, a plurality of external terminal sections 12p, 12q that are disposed in plane on the substrate 1 and have external terminal surfaces 12pb, 12qb as directed to the substrate 1 side, and a plurality of internal terminal sections 11 that are disposed in plane on the substrate 1 and have internal terminal surfaces 11a as opposed to the substrate 1 side. The internal terminal sections 11 and external terminal sections 12p, 12q are connected with a wiring section 17. Part of the external terminal sections 12p are existent on the substrate 1 and is disposed within a predetermined disposition region where semiconductor devices are to be disposed. COPYRIGHT: (C)2009,JPO&INPIT