LEAD FRAME, AND MANUFACTURING METHOD THEREOF
PROBLEM TO BE SOLVED: To solve the problem that although electronic components having upper and lower terminals on both top and reverse surfaces are necessary as equipment has higher density, Sip (System in Package) and POP (Package on Package) using an organic substrate and a plurality of substrate...
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| creator | YAGUCHI YASUTAKE FUKUDA TOSHIYUKI UMEDA TAKASHI TOMITA YOSHIHIRO |
| description | PROBLEM TO BE SOLVED: To solve the problem that although electronic components having upper and lower terminals on both top and reverse surfaces are necessary as equipment has higher density, Sip (System in Package) and POP (Package on Package) using an organic substrate and a plurality of substrates are being developed by respective companies, but all of them use an expensive substrate and has complicated constitution. SOLUTION: An electronic component having upper and lower terminals can be embodied using one lead frame. Specifically, the electronic component has: first and second connection leads, one lead being bent and having the upper and lower terminals. COPYRIGHT: (C)2009,JPO&INPIT |
| format | Patent |
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SOLUTION: An electronic component having upper and lower terminals can be embodied using one lead frame. Specifically, the electronic component has: first and second connection leads, one lead being bent and having the upper and lower terminals. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | LEAD FRAME, AND MANUFACTURING METHOD THEREOF |
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