PACKAGE STRUCTURE

PROBLEM TO BE SOLVED: To provide a package structure having dampproof properties enhanced for sealing the main surface (an element surface) of a substrate of an SAW element or the like with a pattern functioning as an element formed in the space surrounded by a photosensitive heat-resistant resin. S...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUMOTO KUNIO, NAKAJIMA MISAO, HOSAKA NORIO, SUGITA MASAKI, NAGASHIMA SHIRO, TENMYO HIROYUKI, SAKIYAMA KAZUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a package structure having dampproof properties enhanced for sealing the main surface (an element surface) of a substrate of an SAW element or the like with a pattern functioning as an element formed in the space surrounded by a photosensitive heat-resistant resin. SOLUTION: The whole outer surface of the structure of the photosensitive heat-resistant resin 9 for sealing the element surface of the substrate 1 of the SAW element or the like, and a peripheral border of the element surface of the substrate continued to this, are coated by an electrioplating film 5, thereby improving the dampproof properties of the space surrounded by the structure (resin sealing structure) of the photosensitive heat-resistant resin 9 and the element surface of the substrate 1, and for sealing the element surface. COPYRIGHT: (C)2009,JPO&INPIT