WIRE BONDING METHOD

WIRE BONDING METHOD

PROBLEM TO BE SOLVED: To solve a problem wherein wire bonding can not be performed in high position accuracy because a relative position of the center of a ball which is joined to a first bonding point is not stabilized owing to the eccentricity of the ball and a variation in the size of the ball in...

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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PROBLEM TO BE SOLVED: To solve a problem wherein wire bonding can not be performed in high position accuracy because a relative position of the center of a ball which is joined to a first bonding point is not stabilized owing to the eccentricity of the ball and a variation in the size of the ball in a conventional method. SOLUTION: The wire bonding method includes the step of: repairing an inclined wire 11 by moving the position of a capillary 10 so that the capillary is close to a first bonding point 21 in a state in which the wire 11 inclined from the base end of the wire 11 to a first bonding point 21 side by bonding at a second bonding point 22 is inserted before cutting the wire 11. According to the wire bonding method, since the inclination of the wire 11 is decreased, the eccentricity of a ball 11b and a variation in the size of the ball 11b are suppressed, and the relative position of the center of the ball which is joined to the first bonding point to the first bonding point 21 is stabilized. Wire bonding is thereby obtained in high position accuracy. COPYRIGHT: (C)2009,JPO&INPIT
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SOLUTION: The wire bonding method includes the step of: repairing an inclined wire 11 by moving the position of a capillary 10 so that the capillary is close to a first bonding point 21 in a state in which the wire 11 inclined from the base end of the wire 11 to a first bonding point 21 side by bonding at a second bonding point 22 is inserted before cutting the wire 11. According to the wire bonding method, since the inclination of the wire 11 is decreased, the eccentricity of a ball 11b and a variation in the size of the ball 11b are suppressed, and the relative position of the center of the ball which is joined to the first bonding point to the first bonding point 21 is stabilized. Wire bonding is thereby obtained in high position accuracy. 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SOLUTION: The wire bonding method includes the step of: repairing an inclined wire 11 by moving the position of a capillary 10 so that the capillary is close to a first bonding point 21 in a state in which the wire 11 inclined from the base end of the wire 11 to a first bonding point 21 side by bonding at a second bonding point 22 is inserted before cutting the wire 11. According to the wire bonding method, since the inclination of the wire 11 is decreased, the eccentricity of a ball 11b and a variation in the size of the ball 11b are suppressed, and the relative position of the center of the ball which is joined to the first bonding point to the first bonding point 21 is stabilized. Wire bonding is thereby obtained in high position accuracy. 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SOLUTION: The wire bonding method includes the step of: repairing an inclined wire 11 by moving the position of a capillary 10 so that the capillary is close to a first bonding point 21 in a state in which the wire 11 inclined from the base end of the wire 11 to a first bonding point 21 side by bonding at a second bonding point 22 is inserted before cutting the wire 11. According to the wire bonding method, since the inclination of the wire 11 is decreased, the eccentricity of a ball 11b and a variation in the size of the ball 11b are suppressed, and the relative position of the center of the ball which is joined to the first bonding point to the first bonding point 21 is stabilized. Wire bonding is thereby obtained in high position accuracy. COPYRIGHT: (C)2009,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WIRE BONDING METHOD
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