COOLING DEVICE

PROBLEM TO BE SOLVED: To solve the problem of a conventional cooling device with inferior efficiency of removing heat from a package mounted with a heating electronic component generating heat by driving such as a semiconductor device. SOLUTION: In the cooling device 10 which cools the package 14, m...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KOIKE KAZUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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