SILICONE ADHESIVE COMPOSITION FOR OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING IT

PROBLEM TO BE SOLVED: To provide a silicone adhesive composition, which is excellent in adhesiveness, for an optical semiconductor and a highly reliable optical semiconductor device using the silicone adhesive composition. SOLUTION: The silicone adhesive composition comprises (A) alkenyl group-conta...

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description PROBLEM TO BE SOLVED: To provide a silicone adhesive composition, which is excellent in adhesiveness, for an optical semiconductor and a highly reliable optical semiconductor device using the silicone adhesive composition. SOLUTION: The silicone adhesive composition comprises (A) alkenyl group-containing polyorganosiloxane containing (A1) polyorganosiloxane having 50-3,000 ppm hydroxyl groups bonded to silicon atoms, having an SiO4/2unit, and having one or more alkenyl groups bonded to silicon atoms in a molecule on average, (B) polyorganohydrogen siloxane having three or more hydrogen atoms bonded to silicon atoms in a molecular, (C) a platinum-based catalyst, and (D) a tackifier. COPYRIGHT: (C)2009,JPO&INPIT
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2009114365A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2009114365A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2009114365A3</originalsourceid><addsrcrecordid>eNrjZEgM9vTxdPb3c1VwdPFwDfYMc1Vw9vcN8A_2DPH091Nw8w9S8A8I8XR29FEIdvUFqXQJdQ4Bijr6ueCQcXEN83R2VQgN9vRzV_AM4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGloaGJsZmpo7GRCkCAEltNHA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SILICONE ADHESIVE COMPOSITION FOR OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING IT</title><source>esp@cenet</source><creator>HIRAI NOBUO</creator><creatorcontrib>HIRAI NOBUO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a silicone adhesive composition, which is excellent in adhesiveness, for an optical semiconductor and a highly reliable optical semiconductor device using the silicone adhesive composition. SOLUTION: The silicone adhesive composition comprises (A) alkenyl group-containing polyorganosiloxane containing (A1) polyorganosiloxane having 50-3,000 ppm hydroxyl groups bonded to silicon atoms, having an SiO4/2unit, and having one or more alkenyl groups bonded to silicon atoms in a molecule on average, (B) polyorganohydrogen siloxane having three or more hydrogen atoms bonded to silicon atoms in a molecular, (C) a platinum-based catalyst, and (D) a tackifier. COPYRIGHT: (C)2009,JPO&amp;INPIT</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090528&amp;DB=EPODOC&amp;CC=JP&amp;NR=2009114365A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090528&amp;DB=EPODOC&amp;CC=JP&amp;NR=2009114365A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIRAI NOBUO</creatorcontrib><title>SILICONE ADHESIVE COMPOSITION FOR OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING IT</title><description>PROBLEM TO BE SOLVED: To provide a silicone adhesive composition, which is excellent in adhesiveness, for an optical semiconductor and a highly reliable optical semiconductor device using the silicone adhesive composition. SOLUTION: The silicone adhesive composition comprises (A) alkenyl group-containing polyorganosiloxane containing (A1) polyorganosiloxane having 50-3,000 ppm hydroxyl groups bonded to silicon atoms, having an SiO4/2unit, and having one or more alkenyl groups bonded to silicon atoms in a molecule on average, (B) polyorganohydrogen siloxane having three or more hydrogen atoms bonded to silicon atoms in a molecular, (C) a platinum-based catalyst, and (D) a tackifier. COPYRIGHT: (C)2009,JPO&amp;INPIT</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgM9vTxdPb3c1VwdPFwDfYMc1Vw9vcN8A_2DPH091Nw8w9S8A8I8XR29FEIdvUFqXQJdQ4Bijr6ueCQcXEN83R2VQgN9vRzV_AM4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGloaGJsZmpo7GRCkCAEltNHA</recordid><startdate>20090528</startdate><enddate>20090528</enddate><creator>HIRAI NOBUO</creator><scope>EVB</scope></search><sort><creationdate>20090528</creationdate><title>SILICONE ADHESIVE COMPOSITION FOR OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING IT</title><author>HIRAI NOBUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2009114365A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>HIRAI NOBUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIRAI NOBUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SILICONE ADHESIVE COMPOSITION FOR OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING IT</title><date>2009-05-28</date><risdate>2009</risdate><abstract>PROBLEM TO BE SOLVED: To provide a silicone adhesive composition, which is excellent in adhesiveness, for an optical semiconductor and a highly reliable optical semiconductor device using the silicone adhesive composition. SOLUTION: The silicone adhesive composition comprises (A) alkenyl group-containing polyorganosiloxane containing (A1) polyorganosiloxane having 50-3,000 ppm hydroxyl groups bonded to silicon atoms, having an SiO4/2unit, and having one or more alkenyl groups bonded to silicon atoms in a molecule on average, (B) polyorganohydrogen siloxane having three or more hydrogen atoms bonded to silicon atoms in a molecular, (C) a platinum-based catalyst, and (D) a tackifier. COPYRIGHT: (C)2009,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
title SILICONE ADHESIVE COMPOSITION FOR OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING IT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T09%3A47%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HIRAI%20NOBUO&rft.date=2009-05-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2009114365A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true