SILICONE ADHESIVE COMPOSITION FOR OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING IT

PROBLEM TO BE SOLVED: To provide a silicone adhesive composition, which is excellent in adhesiveness, for an optical semiconductor and a highly reliable optical semiconductor device using the silicone adhesive composition. SOLUTION: The silicone adhesive composition comprises (A) alkenyl group-conta...

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1. Verfasser:	HIRAI NOBUO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a silicone adhesive composition, which is excellent in adhesiveness, for an optical semiconductor and a highly reliable optical semiconductor device using the silicone adhesive composition. SOLUTION: The silicone adhesive composition comprises (A) alkenyl group-containing polyorganosiloxane containing (A1) polyorganosiloxane having 50-3,000 ppm hydroxyl groups bonded to silicon atoms, having an SiO4/2unit, and having one or more alkenyl groups bonded to silicon atoms in a molecule on average, (B) polyorganohydrogen siloxane having three or more hydrogen atoms bonded to silicon atoms in a molecular, (C) a platinum-based catalyst, and (D) a tackifier. COPYRIGHT: (C)2009,JPO&INPIT