PACKAGE OF LOW-TEMPERATURE APPLICATION HOT MELT ADHESIVE COMPOUND

PROBLEM TO BE SOLVED: To provide a method for packaging an improved low-temperature hot melt adhesive composite, and a packaged adhesive composite which is obtained by the method. SOLUTION: This packaging method produces a low-temperature hot melt adhesive which can be treated at a low-temperature o...

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Bibliographische Detailangaben
Hauptverfasser: RODGERS ANTHONY P, PAUL CHARLES W
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for packaging an improved low-temperature hot melt adhesive composite, and a packaged adhesive composite which is obtained by the method. SOLUTION: This packaging method produces a low-temperature hot melt adhesive which can be treated at a low-temperature of 135 to 65.5°C, and includes steps of: (1) pressure-sending and pouring the fused hot melt adhesive into a cylindrical tube of a plastic film which includes an ethylene-methyl acrylate copolymer including methyl acrylate more than 10% and has a melting point lower than 90°C, the cylindrical tube directly contacting with a heat emitter for cooling and the fusion adhesive pressure-sent and poured into the tube at a temperature higher than the melting point of the plastic film and cooling water sprayed on the surface of the tube on one hand; (2) sealing the cylinder in which the fusion hot melt adhesive is filled up; and (3) cooling the cylinder which is filled up. COPYRIGHT: (C)2009,JPO&INPIT