DEVICE OF INSPECTING EDGE OF SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To provide an inspecting device for a disc substrate which can accrately and quantitatively inspect the formation position of a film layer formed on the surface of a disc substrate. SOLUTION: The inspecting device is used to inspect a disc substrate wherein a film layer is form...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WAKABA HIROYUKI, MORI HIDEKI, ONO YOKO, MIYAZONO KOICHI, HAYASHI YOSHINORI
Format: Patent
Sprache:eng
Schlagworte:
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