DEVICE OF INSPECTING EDGE OF SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To provide an inspecting device for a disc substrate which can accrately and quantitatively inspect the formation position of a film layer formed on the surface of a disc substrate. SOLUTION: The inspecting device is used to inspect a disc substrate wherein a film layer is formed. It generates a photograph image data showing a photograph image corresponding to a photograph viewing range on the basis of an image signal that is output in sequence from an image pickup section for photographing a specified face in the outer periphery of the disc substrate, and, among the photographed image data, a vertical-direction position YE15aL(θ) at each position (θ) in the circumferential direction of a border line E15abetween a face image section ISacorresponding to the specified face on the photographed image data and its outside image section IBKLis used as a reference. Thus, a film layer edge position information Y4E24(θ) which indicates the vertical-direction position at the position (θ) corresponding to the circumferential direction of an edge line E24of the film layer image section ISa(24) corresponding to the film layer 24 on the face image ISais generated. COPYRIGHT: (C)2009,JPO&INPIT