PIEZOELECTRIC ELEMENT HOUSING PACKAGE

PROBLEM TO BE SOLVED: To provide a piezoelectric element housing package which can prevent the occurrence of cracks due to thermal stress which concentrates at through-holes prepared in a ceramic base, and can form an inexpensive piezoelectric device. SOLUTION: The piezoelectric element housing pack...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NISHIJIMA HIDETAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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