RESIN COMPOSITION FOR MOLDING, MOLDED ARTICLE AND SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a resin package based on a thermosetting resin, and having a high dimensional accuracy, low warpage, low thermal expansion and high heat resistance. SOLUTION: This resin composition for molding comprises (A) an epoxy resin having a naphthalene backbone having a presc...

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Bibliographische Detailangaben
Hauptverfasser:	SADO SATOSHI, ANDO MOTOTAKE, UCHIDA TAKESHI, BUI DOUKU WIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin package based on a thermosetting resin, and having a high dimensional accuracy, low warpage, low thermal expansion and high heat resistance. SOLUTION: This resin composition for molding comprises (A) an epoxy resin having a naphthalene backbone having a prescribed structure, (B) a phenolaralkyl resin-curing agent having a prescribed structure, (C) a curing accelerator and (D) fused silica powder having 10 to 30 μm weight-average particle diameter, wherein the fused silica powder (D) is contained in the molding resin composition in a rate of 80 to 90 mass% and the molding resin composition contains no halogen atom. COPYRIGHT: (C)2009,JPO&INPIT