PRINT MASK FOR PRINTED CIRCUIT BOARD, AND METHOD FOR MOUNTING PRINTED CIRCUIT BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide a print mask which is not affected by the height of a solder precoat portion, exerts no influence on an arrangement interval between a micro electronic component and a large-sized electronic component, and eliminates a leakage of solder paste when the solder paste is...

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Bibliographische Detailangaben
1. Verfasser:	SAKOTA NAOKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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