WAFER PACKAGING METHOD

WAFER PACKAGING METHOD

PROBLEM TO BE SOLVED: To provide a wafer packaging method. SOLUTION: The wafer packaging method comprises: (a) a step S11 of attaching a tape 12 onto one side of a carrier 11, the carrier having a through-hole 111 formed therein; (b) a step S12 of attaching a wafer 13 onto the tape 12 exposed inside...

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Hauptverfasser: CHO SOON-JIN, CHO CHUNG-WOO, RI TOKEI, CHOI JIN-WON, CHO SEUNG HYUN, AHN SEOK-HWAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHO SOON-JIN
CHO CHUNG-WOO
RI TOKEI
CHOI JIN-WON
CHO SEUNG HYUN
AHN SEOK-HWAN
description PROBLEM TO BE SOLVED: To provide a wafer packaging method. SOLUTION: The wafer packaging method comprises: (a) a step S11 of attaching a tape 12 onto one side of a carrier 11, the carrier having a through-hole 111 formed therein; (b) a step S12 of attaching a wafer 13 onto the tape 12 exposed inside the through-hole 111 such that an electrode is exposed; and (c) a step S13 of performing a packaging process on the carrier 11 such that the wafer 13 is packaged. COPYRIGHT: (C)2009,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WAFER PACKAGING METHOD
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