RESIN SEALING DEVICE

PROBLEM TO BE SOLVED: To provide a resin sealing device capable of improving production efficiency. SOLUTION: The device includes a substrate stage 2A that holds a substrate KA substantially horizontally, an imaging camera 4a that captures an image of an on-board chip mounted on the substrate, a cam...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TERADA KATSUMI, OKAMOTO SHUNICHI, SASAKI NARIHISA, KURIMASA TOSHIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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