SPUTTERING TARGET MATERIAL AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a sputtering target material which is composed by joining a plurality of target material pieces and can solve the following problem: when the sputtering target material is used for a sputtering process and various conductive films are deposited on a glass substrate, defective manufacture such as non-uniform film thickness of the conductive film occurs, and to provide its manufacturing method. SOLUTION: The butted sectional shape 2 of a joined part of target material pieces 1a, 1b is formed in an assembled structure having ruggedness to be fitted with each other without any void. A sputtering target material itself is used while the assembled structures are fitted with each other without any void. In such a case, friction stir welding is not applied to a surface side (right face side) 3 being the sputtering surface, but the friction stir welding is performed from a back surface side 4 opposite to the surface side 3 to join the target material pieces 1a, 1b with each other. COPYRIGHT: (C)2009,JPO&INPIT