METHOD FOR MANUFACTURING TAB TAPE
PROBLEM TO BE SOLVED: To provide a method for manufacturing a TAB tape, which can prevent a bipolar phenomenon from occurring during a via-conducting plating operation, and can form a sound via-conducting plated layer with high reliability. SOLUTION: In a process of manufacturing the TAB tape by for...
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| creator | KOSAKA HIROYUKI MATSUO NAGAYOSHI SUGIMOTO HIROSHI ASAKAWA TOMOYUKI |
| description | PROBLEM TO BE SOLVED: To provide a method for manufacturing a TAB tape, which can prevent a bipolar phenomenon from occurring during a via-conducting plating operation, and can form a sound via-conducting plated layer with high reliability. SOLUTION: In a process of manufacturing the TAB tape by forming wiring layers on both surfaces of an insulating film, forming a via hole in the film tape 2 from one side of the wiring layer toward the other side of the wiring layer, affixing a masking tape 6 onto the surface of the other side of the wiring layer on the film tape 2, and passing the film tape 2 in this state through a plating tank 3 to form a via-conducting plated layer in the one side of the wiring layer and in the inside of the via hole, the method of forming the via-conducting plated layer includes passing the film tape 2 through the plating tank 3 while passing an electric current to the one side of the wiring layer by bringing a power supply roll 9 in a plating side in contact with the one side of the wiring layer, and simultaneously passing an electric current to the other side of the wiring layer, on which the masking tape 6 is affixed, by bringing a power supply roll 10 in a non-plating side in contact with the other side of the wiring layer. COPYRIGHT: (C)2009,JPO&INPIT |
| format | Patent |
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SOLUTION: In a process of manufacturing the TAB tape by forming wiring layers on both surfaces of an insulating film, forming a via hole in the film tape 2 from one side of the wiring layer toward the other side of the wiring layer, affixing a masking tape 6 onto the surface of the other side of the wiring layer on the film tape 2, and passing the film tape 2 in this state through a plating tank 3 to form a via-conducting plated layer in the one side of the wiring layer and in the inside of the via hole, the method of forming the via-conducting plated layer includes passing the film tape 2 through the plating tank 3 while passing an electric current to the one side of the wiring layer by bringing a power supply roll 9 in a plating side in contact with the one side of the wiring layer, and simultaneously passing an electric current to the other side of the wiring layer, on which the masking tape 6 is affixed, by bringing a power supply roll 10 in a non-plating side in contact with the other side of the wiring layer. 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SOLUTION: In a process of manufacturing the TAB tape by forming wiring layers on both surfaces of an insulating film, forming a via hole in the film tape 2 from one side of the wiring layer toward the other side of the wiring layer, affixing a masking tape 6 onto the surface of the other side of the wiring layer on the film tape 2, and passing the film tape 2 in this state through a plating tank 3 to form a via-conducting plated layer in the one side of the wiring layer and in the inside of the via hole, the method of forming the via-conducting plated layer includes passing the film tape 2 through the plating tank 3 while passing an electric current to the one side of the wiring layer by bringing a power supply roll 9 in a plating side in contact with the one side of the wiring layer, and simultaneously passing an electric current to the other side of the wiring layer, on which the masking tape 6 is affixed, by bringing a power supply roll 10 in a non-plating side in contact with the other side of the wiring layer. 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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES |
| title | METHOD FOR MANUFACTURING TAB TAPE |
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