CCD SOLID-STATE IMAGING ELEMENT, AND MANUFACTURING METHOD THEREOF
PROBLEM TO BE SOLVED: To provide a CCD solid-state imaging element achieving high speed vertical charge transfer, and to provide a manufacturing method thereof. SOLUTION: The CCD solid-state imaging element includes a plurality of pixels formed on a semiconductor substrate in a two-dimensional array...
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creator | KOBAYASHI MAKOTO FUJISAWA KAORU |
description | PROBLEM TO BE SOLVED: To provide a CCD solid-state imaging element achieving high speed vertical charge transfer, and to provide a manufacturing method thereof. SOLUTION: The CCD solid-state imaging element includes a plurality of pixels formed on a semiconductor substrate in a two-dimensional array, a vertical charge transfer path formed for each pixel column along the pixel column, a plurality of bus line wiring 7-i laminated on vertical transfer electrodes Vi constituting vertical charge transfer paths with an insulating layer interposed and supply vertical transfer pulses to the vertical transfer electrodes, and a contact 8 connecting each of the bus line wiring 7-i to a corresponding vertical transfer electrode Vi, wherein ends of all the vertical transfer electrodes Vi on sides of the bus line wiring 7-i are extended to positions where they cross all the bus line wiring 7-i, and a vertical transfer electrode is cut 12-i between the place where the contact 8 is formed and a bus line wiring 7-i which is adjacent to the region where the pixels are formed on the opposite side. COPYRIGHT: (C)2009,JPO&INPIT |
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SOLUTION: The CCD solid-state imaging element includes a plurality of pixels formed on a semiconductor substrate in a two-dimensional array, a vertical charge transfer path formed for each pixel column along the pixel column, a plurality of bus line wiring 7-i laminated on vertical transfer electrodes Vi constituting vertical charge transfer paths with an insulating layer interposed and supply vertical transfer pulses to the vertical transfer electrodes, and a contact 8 connecting each of the bus line wiring 7-i to a corresponding vertical transfer electrode Vi, wherein ends of all the vertical transfer electrodes Vi on sides of the bus line wiring 7-i are extended to positions where they cross all the bus line wiring 7-i, and a vertical transfer electrode is cut 12-i between the place where the contact 8 is formed and a bus line wiring 7-i which is adjacent to the region where the pixels are formed on the opposite side. 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SOLUTION: The CCD solid-state imaging element includes a plurality of pixels formed on a semiconductor substrate in a two-dimensional array, a vertical charge transfer path formed for each pixel column along the pixel column, a plurality of bus line wiring 7-i laminated on vertical transfer electrodes Vi constituting vertical charge transfer paths with an insulating layer interposed and supply vertical transfer pulses to the vertical transfer electrodes, and a contact 8 connecting each of the bus line wiring 7-i to a corresponding vertical transfer electrode Vi, wherein ends of all the vertical transfer electrodes Vi on sides of the bus line wiring 7-i are extended to positions where they cross all the bus line wiring 7-i, and a vertical transfer electrode is cut 12-i between the place where the contact 8 is formed and a bus line wiring 7-i which is adjacent to the region where the pixels are formed on the opposite side. COPYRIGHT: (C)2009,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES |
title | CCD SOLID-STATE IMAGING ELEMENT, AND MANUFACTURING METHOD THEREOF |
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