SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve heat dissipation of a semiconductor device using a semiconductor chip. SOLUTION: The semiconductor device having the semiconductor chip (30) mounted on a mounting substrate (20) of a hybrid integrated circuit is characterized by having a heat dissipation material (40...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HATTORI SHINICHIRO, TSURUNO MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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