EASILY PEELABLE ONE PACK MOISTURE-CURING TYPE ADHESIVE

PROBLEM TO BE SOLVED: To provide an easily peelable one pack moisture-curing type adhesive which is used for adhering a floor material to a floor substrate, can easily be coated on the floor substrate, and can exert a high shear adhesive strength, a low crack adhesive strength and a low peeling adhe...

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Bibliographische Detailangaben
Hauptverfasser:	ITO YUSUKE, SATO AKIHIRO, INOUE FUMIKO, KOGA SHIGEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an easily peelable one pack moisture-curing type adhesive which is used for adhering a floor material to a floor substrate, can easily be coated on the floor substrate, and can exert a high shear adhesive strength, a low crack adhesive strength and a low peeling adhesive strength, after adhered. SOLUTION: This adhesive has a composition having a powder component (X): liquid component (Y)=1.5 to 2.7:1 (weight ratio). The powder component (X) comprises a hollow powder (a): solid powder (b)=0.3 to 2.0:1 (volume ratio). The hollow powder (a) and the solid powder (b) function as fillers. The liquid component (Y) comprises a moisture reaction-curable hydrolysable silyl group-containing polyoxyalkylene polymer (c) and a non-reacting liquid component (d) consisting mainly of a high molecular polymer in a (c):(d) (weight ratio)=0.2 to 0.5:1. All the components are homogeneously mixed, to form an adhesive having a viscosity of 10 to 150 Pa. COPYRIGHT: (C)2009,JPO&INPIT