METHOD FOR MANUFACTURING MASK BLANK AND METHOD FOR MANUFACTURING PHOTOMASK

PROBLEM TO BE SOLVED: To provide a method for manufacturing a mask blank with which uneven coating is prevented and satisfactory uniformity in the coating film thickness in a substrate plane is achieved when a resist film on the substrate surface is formed by using a CAP coater (capillary coater). S...

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description PROBLEM TO BE SOLVED: To provide a method for manufacturing a mask blank with which uneven coating is prevented and satisfactory uniformity in the coating film thickness in a substrate plane is achieved when a resist film on the substrate surface is formed by using a CAP coater (capillary coater). SOLUTION: The method for manufacturing a mask blank includes a step of forming a resist film by bringing a resist agent in a liquid state which passes from a liquid tank housing the resist agent through a nozzle 22 to reach the aperture of the nozzle top end, into contact with the surface of a substrate 10 to be coated which has a thin film for forming a transfer pattern, and relatively moving the substrate and the nozzle to apply the resist agent on the surface to be coated. During the relative movement in the step of forming the resist film, the liquid is applied while keeping the spacing between the nozzle and the substrate as the liquid contact gap when the nozzle is brought into contact with the substrate in a prescribed region where the nozzle moves from the liquid contact position near the substrate end to reach a prescribed position on the substrate, and then the liquid is applied by changing the spacing between the nozzle and the substrate to a prescribed coating gap. COPYRIGHT: (C)2009,JPO&INPIT
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SOLUTION: The method for manufacturing a mask blank includes a step of forming a resist film by bringing a resist agent in a liquid state which passes from a liquid tank housing the resist agent through a nozzle 22 to reach the aperture of the nozzle top end, into contact with the surface of a substrate 10 to be coated which has a thin film for forming a transfer pattern, and relatively moving the substrate and the nozzle to apply the resist agent on the surface to be coated. During the relative movement in the step of forming the resist film, the liquid is applied while keeping the spacing between the nozzle and the substrate as the liquid contact gap when the nozzle is brought into contact with the substrate in a prescribed region where the nozzle moves from the liquid contact position near the substrate end to reach a prescribed position on the substrate, and then the liquid is applied by changing the spacing between the nozzle and the substrate to a prescribed coating gap. 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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
title METHOD FOR MANUFACTURING MASK BLANK AND METHOD FOR MANUFACTURING PHOTOMASK
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