COOLER AND MANUFACTURING METHOD OF COOLER

COOLER AND MANUFACTURING METHOD OF COOLER

PROBLEM TO BE SOLVED: To improve a cooling performance by making the porosity of a base body part larger at the upper part than at the lower part in the vertical direction. SOLUTION: The cooler includes the base body part 1 with a plurality of pores, a case body 11 formed so as to surround the base...

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Hauptverfasser: MORINO MASAHIRO, TAKETSUNA YASUHARU, TAKANO HISAYA
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MORINO MASAHIRO
TAKETSUNA YASUHARU
TAKANO HISAYA
description PROBLEM TO BE SOLVED: To improve a cooling performance by making the porosity of a base body part larger at the upper part than at the lower part in the vertical direction. SOLUTION: The cooler includes the base body part 1 with a plurality of pores, a case body 11 formed so as to surround the base body part 1, and a cooling pipe for making a coolant flow inside the case body 11. The case body 11 has a contact part 11a with which a heating element 31 is brought into contact on a surface on the lower side in the vertical direction. The base body part 1 is formed such that the porosity is larger at the upper part than at the lower part in the vertical direction. The cooling pipe includes a supply pipe 21 and a discharge pipe 22, and the supply pipe 21 and the discharge pipe 22 are connected to a lower part of the case body 11. COPYRIGHT: (C)2009,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title COOLER AND MANUFACTURING METHOD OF COOLER
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