CURABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a moisture-curable type resin composition containing a hydrolyzable silyl group-containing curable resin as a base polymer, and preventing adhesiveness from getting low after exposed to heat. SOLUTION: This curable resin composition is added with (ii) a compound (B)...

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Bibliographische Detailangaben
Hauptverfasser:	NOMURA YUKIHIRO, SATO SHINICHI, KUSUKI KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a moisture-curable type resin composition containing a hydrolyzable silyl group-containing curable resin as a base polymer, and preventing adhesiveness from getting low after exposed to heat. SOLUTION: This curable resin composition is added with (ii) a compound (B) obtained by a reaction of 0.1-30 pts. of an amino group-containing silane compound with 0.1-15 pts. of an epoxy resin, and (iii) 0.001-10 pts.mass of compound (C) comprising boron trifluoride and/or a complex thereof, (i) with respect to 100 pts. of a hydrolyzable silyl group-containing curable resin (A) expressed by the general formula (1), where X represents a hydrolyzable group such as a hydroxy group and an alkoxy group, R1represents a C1-C20 alkyl group, and n represents 0, 1 or 2. COPYRIGHT: (C)2009,JPO&INPIT