CHIP-TYPE ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a chip-type electronic component which improves flatness without the provision of a secondary electrode, and to provide a manufacturing method therefore. SOLUTION: The chip-type electronic component comprises: a rectangular-shaped chip substrate provided with a surfa...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MUKAI SEISHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY RESISTORS
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