SUBSTRATE HOLDER, FILM DEPOSITION APPARATUS, AND FILM DEPOSITION METHOD

PROBLEM TO BE SOLVED: To realize a film deposition apparatus of high film deposition efficiency relating to a substrate holder in a vacuum vapor deposition, a film deposition apparatus, and a film deposition method. SOLUTION: The substrate holder 50 which holds a plurality of the substrates W on the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	TAKIMOTO MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	TAKIMOTO MASAYUKI
description	PROBLEM TO BE SOLVED: To realize a film deposition apparatus of high film deposition efficiency relating to a substrate holder in a vacuum vapor deposition, a film deposition apparatus, and a film deposition method. SOLUTION: The substrate holder 50 which holds a plurality of the substrates W on the planar inverting tools 57 holding the substrates and holds four sheets of the inverting tools 57 is arranged in a vacuum chamber in such a manner that the substrates W and a vapor deposition source face each other, and the vacuum deposition is started. When films are deposited on the substrates W facing the vapor deposition source, the substrate holder 50 is rotated 90. The inverting tools 57 deposited with the film on one surface is inverted by rotating a Geneva 581 integrated with the inverting tools 57. The vacuum deposition is continued until the films are deposited on both surfaces of all the inverting tools 57. COPYRIGHT: (C)2009,JPO&INPIT
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2008240105A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2008240105A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2008240105A3</originalsourceid><addsrcrecordid>eNrjZHAPDnUKDglyDHFV8PD3cXEN0lFw8_TxVXBxDfAP9gzx9PdTcAwIcAQqCA3WUXD0c8GQ9nUN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGFkYmBoYGpo7GRCkCADNjLPI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE HOLDER, FILM DEPOSITION APPARATUS, AND FILM DEPOSITION METHOD</title><source>esp@cenet</source><creator>TAKIMOTO MASAYUKI</creator><creatorcontrib>TAKIMOTO MASAYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To realize a film deposition apparatus of high film deposition efficiency relating to a substrate holder in a vacuum vapor deposition, a film deposition apparatus, and a film deposition method. SOLUTION: The substrate holder 50 which holds a plurality of the substrates W on the planar inverting tools 57 holding the substrates and holds four sheets of the inverting tools 57 is arranged in a vacuum chamber in such a manner that the substrates W and a vapor deposition source face each other, and the vacuum deposition is started. When films are deposited on the substrates W facing the vapor deposition source, the substrate holder 50 is rotated 90. The inverting tools 57 deposited with the film on one surface is inverted by rotating a Geneva 581 integrated with the inverting tools 57. The vacuum deposition is continued until the films are deposited on both surfaces of all the inverting tools 57. COPYRIGHT: (C)2009,JPO&INPIT</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20081009&DB=EPODOC&CC=JP&NR=2008240105A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20081009&DB=EPODOC&CC=JP&NR=2008240105A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKIMOTO MASAYUKI</creatorcontrib><title>SUBSTRATE HOLDER, FILM DEPOSITION APPARATUS, AND FILM DEPOSITION METHOD</title><description>PROBLEM TO BE SOLVED: To realize a film deposition apparatus of high film deposition efficiency relating to a substrate holder in a vacuum vapor deposition, a film deposition apparatus, and a film deposition method. SOLUTION: The substrate holder 50 which holds a plurality of the substrates W on the planar inverting tools 57 holding the substrates and holds four sheets of the inverting tools 57 is arranged in a vacuum chamber in such a manner that the substrates W and a vapor deposition source face each other, and the vacuum deposition is started. When films are deposited on the substrates W facing the vapor deposition source, the substrate holder 50 is rotated 90. The inverting tools 57 deposited with the film on one surface is inverted by rotating a Geneva 581 integrated with the inverting tools 57. The vacuum deposition is continued until the films are deposited on both surfaces of all the inverting tools 57. COPYRIGHT: (C)2009,JPO&INPIT</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAPDnUKDglyDHFV8PD3cXEN0lFw8_TxVXBxDfAP9gzx9PdTcAwIcAQqCA3WUXD0c8GQ9nUN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGFkYmBoYGpo7GRCkCADNjLPI</recordid><startdate>20081009</startdate><enddate>20081009</enddate><creator>TAKIMOTO MASAYUKI</creator><scope>EVB</scope></search><sort><creationdate>20081009</creationdate><title>SUBSTRATE HOLDER, FILM DEPOSITION APPARATUS, AND FILM DEPOSITION METHOD</title><author>TAKIMOTO MASAYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2008240105A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKIMOTO MASAYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKIMOTO MASAYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE HOLDER, FILM DEPOSITION APPARATUS, AND FILM DEPOSITION METHOD</title><date>2008-10-09</date><risdate>2008</risdate><abstract>PROBLEM TO BE SOLVED: To realize a film deposition apparatus of high film deposition efficiency relating to a substrate holder in a vacuum vapor deposition, a film deposition apparatus, and a film deposition method. SOLUTION: The substrate holder 50 which holds a plurality of the substrates W on the planar inverting tools 57 holding the substrates and holds four sheets of the inverting tools 57 is arranged in a vacuum chamber in such a manner that the substrates W and a vapor deposition source face each other, and the vacuum deposition is started. When films are deposited on the substrates W facing the vapor deposition source, the substrate holder 50 is rotated 90. The inverting tools 57 deposited with the film on one surface is inverted by rotating a Geneva 581 integrated with the inverting tools 57. The vacuum deposition is continued until the films are deposited on both surfaces of all the inverting tools 57. COPYRIGHT: (C)2009,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_JP2008240105A
source	esp@cenet
subjects	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title	SUBSTRATE HOLDER, FILM DEPOSITION APPARATUS, AND FILM DEPOSITION METHOD
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T06%3A34%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAKIMOTO%20MASAYUKI&rft.date=2008-10-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2008240105A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true