WIRING CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
PROBLEM TO BE SOLVED: To provide a wiring circuit board which has an insulating resin layer and a wiring conductor firmly bonded to each other and has superior connection reliability, among wiring conductors in a via hole with high wiring density and less warpage or deformation, and to provide a met...
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| creator | OSUMI KOICHI YAMADA HIROICHI |
| description | PROBLEM TO BE SOLVED: To provide a wiring circuit board which has an insulating resin layer and a wiring conductor firmly bonded to each other and has superior connection reliability, among wiring conductors in a via hole with high wiring density and less warpage or deformation, and to provide a method of manufacturing the wiring circuit board. SOLUTION: The wiring circuit board comprises a lower insulating resin layer and a lower wiring conductor, an upper insulating resin layer laminated on the lower insulating resin layer and the lower wiring conductor, while having a via hole 9 reaching the lower wiring conductor, and an upper wiring conductor as a metal-plated layer formed so as to cover from the lower wiring conductor within the via hole 9 to the upper insulating resin layer. The metal-plated layer includes a first metal-plated layer 5A, formed so as to fill a lower part in the interior of the via hole 9 and a second metal-plated layer 5B formed so as to cover from the first metal-plated layer 5A to the upper insulating resin layer. COPYRIGHT: (C)2009,JPO&INPIT |
| format | Patent |
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SOLUTION: The wiring circuit board comprises a lower insulating resin layer and a lower wiring conductor, an upper insulating resin layer laminated on the lower insulating resin layer and the lower wiring conductor, while having a via hole 9 reaching the lower wiring conductor, and an upper wiring conductor as a metal-plated layer formed so as to cover from the lower wiring conductor within the via hole 9 to the upper insulating resin layer. The metal-plated layer includes a first metal-plated layer 5A, formed so as to fill a lower part in the interior of the via hole 9 and a second metal-plated layer 5B formed so as to cover from the first metal-plated layer 5A to the upper insulating resin layer. 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SOLUTION: The wiring circuit board comprises a lower insulating resin layer and a lower wiring conductor, an upper insulating resin layer laminated on the lower insulating resin layer and the lower wiring conductor, while having a via hole 9 reaching the lower wiring conductor, and an upper wiring conductor as a metal-plated layer formed so as to cover from the lower wiring conductor within the via hole 9 to the upper insulating resin layer. The metal-plated layer includes a first metal-plated layer 5A, formed so as to fill a lower part in the interior of the via hole 9 and a second metal-plated layer 5B formed so as to cover from the first metal-plated layer 5A to the upper insulating resin layer. 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SOLUTION: The wiring circuit board comprises a lower insulating resin layer and a lower wiring conductor, an upper insulating resin layer laminated on the lower insulating resin layer and the lower wiring conductor, while having a via hole 9 reaching the lower wiring conductor, and an upper wiring conductor as a metal-plated layer formed so as to cover from the lower wiring conductor within the via hole 9 to the upper insulating resin layer. The metal-plated layer includes a first metal-plated layer 5A, formed so as to fill a lower part in the interior of the via hole 9 and a second metal-plated layer 5B formed so as to cover from the first metal-plated layer 5A to the upper insulating resin layer. COPYRIGHT: (C)2009,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | WIRING CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR |
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