POLYAMIDE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a polyamide resin composition comprising a polyamide resin and a platy inorganic reinforcement and excellent in toughness and high-temperature rigidity. SOLUTION: The polyamide resin composition comprises a polyamide resin which is composed of (A) polyamide 66 and (B...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: YASUDA AKIMITSU
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a polyamide resin composition comprising a polyamide resin and a platy inorganic reinforcement and excellent in toughness and high-temperature rigidity. SOLUTION: The polyamide resin composition comprises a polyamide resin which is composed of (A) polyamide 66 and (B) at least one selected from among polyamide 6, polyamide 610 and polyamide 612, has a weight ratio of (A)/(B) of 60/40-90/10, and contains a platy inorganic reinforcement having an average particle size of 3 μm or less and in an amount of 20-50 wt.% in terms of inorganic ash content. COPYRIGHT: (C)2009,JPO&INPIT