LED PACKAGE

PROBLEM TO BE SOLVED: To prevent poor conduction by preventing the destruction of solder by effectively relaxing stresses generated due to the difference in the coefficients of linear expansion from a mounting board. SOLUTION: The LED package is provided with a three-dimensional type substrate 12 on...

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Bibliographische Detailangaben
Hauptverfasser:	MUTO MASAHIDE, SHINDO TAKASHI, YOSHIDA HIROYUKI, UCHINONO YOSHIYUKI, SATO MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent poor conduction by preventing the destruction of solder by effectively relaxing stresses generated due to the difference in the coefficients of linear expansion from a mounting board. SOLUTION: The LED package is provided with a three-dimensional type substrate 12 on which an LED chip 11 is mounted and which is mounted on the mounting board 20 electrically connected with the LED chip 11, and a plurality of elastic bodies 17 loaded on the mounting board 20 through solder 21. The plurality of elastic bodies 17 hold the position to the mounting board 20 of the three-dimensional substrate 12 by elastic force supplied from a plurality of outer side faces facing both, which are the outer side faces of the three-dimensional substrate 12, to the inner surface side. COPYRIGHT: (C)2008,JPO&INPIT