METHOD FOR MOUNTING COMPONENT
PROBLEM TO BE SOLVED: To provide a method for mounting components at a high speed by shortening the mounting time per component and also for mounting components with high accuracy. SOLUTION: This mounting method includes process of: positioning a mounting head 13 at a mounting position 1 by moving s...
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| creator | MAE TAKAHARU ONOBORI SHUNJI SHIDA SATOSHI KUKIHARA SATOSHI TSUJISAWA TAKAFUMI |
| description | PROBLEM TO BE SOLVED: To provide a method for mounting components at a high speed by shortening the mounting time per component and also for mounting components with high accuracy. SOLUTION: This mounting method includes process of: positioning a mounting head 13 at a mounting position 1 by moving straightly the mounting head 13 which has received a component 2 at a component supplying position; positioning the mounting head 13 by moving the mounting objective 3 so that the position at which the component 2 held on the mounting head 13 should be positioned, is caused to be the mounting position 1, while the mounting head 13 reciprocates between the component supplying position and the mounting position 1 to be positioned at the mounting position 1, to recognize the position of the mounting objective 3 by a recognizing means 17 positioned at the mounting position 1; and recognizing the component 2 held on the mounting head 13 by recognizing means 17 positioned at the mounting position 1 at the same time as that the mounting head 13 is moved straightly and positioned at the mounting position 1 to position-correct the mounting objective 3 which has been moved toward the mounting position 1 and positioned thereat with a small position-corrected amount, based on the above recognizing result. COPYRIGHT: (C)2008,JPO&INPIT |
| format | Patent |
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SOLUTION: This mounting method includes process of: positioning a mounting head 13 at a mounting position 1 by moving straightly the mounting head 13 which has received a component 2 at a component supplying position; positioning the mounting head 13 by moving the mounting objective 3 so that the position at which the component 2 held on the mounting head 13 should be positioned, is caused to be the mounting position 1, while the mounting head 13 reciprocates between the component supplying position and the mounting position 1 to be positioned at the mounting position 1, to recognize the position of the mounting objective 3 by a recognizing means 17 positioned at the mounting position 1; and recognizing the component 2 held on the mounting head 13 by recognizing means 17 positioned at the mounting position 1 at the same time as that the mounting head 13 is moved straightly and positioned at the mounting position 1 to position-correct the mounting objective 3 which has been moved toward the mounting position 1 and positioned thereat with a small position-corrected amount, based on the above recognizing result. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | METHOD FOR MOUNTING COMPONENT |
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