MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of transferring a layer to be transferred onto a transfer destination substrate by a simple method. SOLUTION: The method of manufacturing a semiconductor device includes: a process for bonding the layer 12 to b...

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1. Verfasser: KAMINE TETSUJI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KAMINE TETSUJI
description PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of transferring a layer to be transferred onto a transfer destination substrate by a simple method. SOLUTION: The method of manufacturing a semiconductor device includes: a process for bonding the layer 12 to be transferred arranged on a first substrate (transfer source substrate) to a second one (first transfer destination substrate 20) made of a water-soluble material by a water-soluble adhesive (adhesive layer 23); a process for separating the layer 12 to be transferred from the first substrate; a process for bonding a surface separated from the first substrate of the layer 12 to be transferred to a third substrate (second transfer destination substrate 30); and a process for dissolving the second substrate 20 and the water-soluble adhesive (adhesive layer 23) into water for removal. COPYRIGHT: (C)2008,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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