TOOL FOR SUBSTRATE PLATING AND SUBSTRATE PLATING APPARATUS

PROBLEM TO BE SOLVED: To provide: a method for plating a substrate by which both surfaces of the substrate to be plated can be simultaneously plated, the plating process can be drastically shortened, and a metal plating film can be formed even in a through-hole and a hole pattern; a tool for substra...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YAMAMOTO TADAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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