FILM-FORMING APPARATUS, FILM-FORMING METHOD, INSULATION FILM, DIELECTRIC FILM, PIEZOELECTRIC FILM, FERROELECTRIC FILM, PIEZOELECTRIC ELEMENT AND LIQUID DISCHARGE DEVICE

PROBLEM TO BE SOLVED: To stably form a film of high quality in a film-forming apparatus and a film-forming method using plasma. SOLUTION: In a film-forming apparatus 300 including a vacuum chamber 310 having a gas inlet for a film-forming gas G and a gas outlet, a target holder 12 disposed in the va...

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Bibliographische Detailangaben
1. Verfasser:	FUJII TAKAMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CORRECTION OF TYPOGRAPHICAL ERRORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LINING MACHINES METALLURGY PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TYPEWRITERS
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