MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board capable of easily removing an interlayer adhesive layer and an outer layer base corresponding to a lead pattern portion with high precision. SOLUTION: An inner layer circuit pattern portion Acf and a lead pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKAMOTO YUJI, UENO YUKIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!