COOLING STRUCTURE FOR ELECTRONIC APPARATUS
PROBLEM TO BE SOLVED: To suppress growing in size and increasing in cost by efficiently cooling a peripheral component in addition to cooling a heat generating component mounted on a substrate. SOLUTION: A cylindrical contact part 17 to thermally contact a CPU 14, a downward shielding wall 18, and a...
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| creator | TAKAAI KAZUO |
| description | PROBLEM TO BE SOLVED: To suppress growing in size and increasing in cost by efficiently cooling a peripheral component in addition to cooling a heat generating component mounted on a substrate. SOLUTION: A cylindrical contact part 17 to thermally contact a CPU 14, a downward shielding wall 18, and a cooling fin 19 are integrally arranged in a heat spreader 12 arranged in the upper part of the substrate 13. The heat spreader 12 includes: an air intake port 22; and a fan device 16 arranged thereon. The cooing fin 19 is extended from the lower surface of the heat spreader 12 toward the upper surface of the substrate 13, so as to form a ventilation passage 23 between the upper surface of the substrate 13 and the lower surface of the heat spreader 12. An inlet side pressure chamber 24 is arranged in the air intake port 22 and an outlet side pressure chamber 25 is arranged at the side of a discharge port 21. A space part 26 is arranged in the circumferential part of the contact part 17 (the CPU 14). Levels 19a, 19b are arranged at the lower end part of the cooling fin 19 in response to the height dimension of the component 15 on the substrate 13. COPYRIGHT: (C)2008,JPO&INPIT |
| format | Patent |
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SOLUTION: A cylindrical contact part 17 to thermally contact a CPU 14, a downward shielding wall 18, and a cooling fin 19 are integrally arranged in a heat spreader 12 arranged in the upper part of the substrate 13. The heat spreader 12 includes: an air intake port 22; and a fan device 16 arranged thereon. The cooing fin 19 is extended from the lower surface of the heat spreader 12 toward the upper surface of the substrate 13, so as to form a ventilation passage 23 between the upper surface of the substrate 13 and the lower surface of the heat spreader 12. An inlet side pressure chamber 24 is arranged in the air intake port 22 and an outlet side pressure chamber 25 is arranged at the side of a discharge port 21. A space part 26 is arranged in the circumferential part of the contact part 17 (the CPU 14). Levels 19a, 19b are arranged at the lower end part of the cooling fin 19 in response to the height dimension of the component 15 on the substrate 13. 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SOLUTION: A cylindrical contact part 17 to thermally contact a CPU 14, a downward shielding wall 18, and a cooling fin 19 are integrally arranged in a heat spreader 12 arranged in the upper part of the substrate 13. The heat spreader 12 includes: an air intake port 22; and a fan device 16 arranged thereon. The cooing fin 19 is extended from the lower surface of the heat spreader 12 toward the upper surface of the substrate 13, so as to form a ventilation passage 23 between the upper surface of the substrate 13 and the lower surface of the heat spreader 12. An inlet side pressure chamber 24 is arranged in the air intake port 22 and an outlet side pressure chamber 25 is arranged at the side of a discharge port 21. A space part 26 is arranged in the circumferential part of the contact part 17 (the CPU 14). Levels 19a, 19b are arranged at the lower end part of the cooling fin 19 in response to the height dimension of the component 15 on the substrate 13. COPYRIGHT: (C)2008,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS |
| title | COOLING STRUCTURE FOR ELECTRONIC APPARATUS |
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