GLASS CERAMIC MULTILAYER CIRCUIT BOARD

GLASS CERAMIC MULTILAYER CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a glass ceramic multilayer circuit board having high dimensional accuracy, even for thin board thickness, i.e. when the thickness of insulating layer is small, and the board strength becomes stably high. SOLUTION: In the glass ceramic multilayer circuit board 1 in wh...

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Hauptverfasser: YAMAMOTO KOJI, ONITANI MASAMITSU, KAWAI SHINYA
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator YAMAMOTO KOJI
ONITANI MASAMITSU
KAWAI SHINYA
description PROBLEM TO BE SOLVED: To provide a glass ceramic multilayer circuit board having high dimensional accuracy, even for thin board thickness, i.e. when the thickness of insulating layer is small, and the board strength becomes stably high. SOLUTION: In the glass ceramic multilayer circuit board 1 in which a plurality of insulating layers, having different composition, are laminated and shrinkage in a planar direction is suppressed, by reducing an outermost insulating layer 3 in thickness and making the proportion of an amorphous layer larger than that of the insulating layer, disposed in contact with the inside of the outermost insulating layer 3. The glass ceramic multilayer circuit board 1 that has smaller deterioration in strength even if its thickness is reduced, can be provided. COPYRIGHT: (C)2008,JPO&INPIT
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title GLASS CERAMIC MULTILAYER CIRCUIT BOARD
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