METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
PROBLEM TO BE SOLVED: To provide a technology which can elevate the reliability of a semiconductor integrated circuit device. SOLUTION: In a wafer manufacturing stage, a visual inspection of a semiconductor integrated circuit device WPP100, on both sides of whose bump a rewiring layer is formed, is...
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| creator | AKAIWA MASAYASU |
| description | PROBLEM TO BE SOLVED: To provide a technology which can elevate the reliability of a semiconductor integrated circuit device. SOLUTION: In a wafer manufacturing stage, a visual inspection of a semiconductor integrated circuit device WPP100, on both sides of whose bump a rewiring layer is formed, is conducted in a manner such that a process which takes a picture of it by a camera 202 irradiating light from a coaxially down-irradiating illuminator 204 in a coaxially down-irradiating direction and a process which takes a picture of it by a camera 202 irradiating light from a diffusion illuminator 205 in a direction crossing the taking-a-photo direction are changed in order, and a pattern matching is conducted between a previously obtained image and a previously pictured teaching image, thereby, it is determined whether there is a defect. COPYRIGHT: (C)2008,JPO&INPIT |
| format | Patent |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
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