ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT PACKAGING METHOD
PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component packaging method in which poor joint can be prevented when an easy-to-warp electronic component is packaged by solder joint. SOLUTION: When an electronic component 16 having a plurality of solder bum...
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| creator | HIYOSHI MASAYOSHI OKAMOTO KAZUO TOMOYASU KAZUHIKO MORITA TAKESHI NISHI SHOICHI |
| description | PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component packaging method in which poor joint can be prevented when an easy-to-warp electronic component is packaged by solder joint. SOLUTION: When an electronic component 16 having a plurality of solder bumps 16a formed on the lower surface is packaged on a substrate, the electronic component mounting device reads out the paste transfer information including the component warpage information indicative of the state of warpage of the electronic component in the reflow process from a library and forms a coating 7a having a film thickness distribution for transferring a desired amount of solder paste to each of a plurality of solder bumps depending on the state of warpage on a paste transfer unit 24 based on the library data thus read out. Consequently, poor joint can be prevented when an easy-to-warp electronic component is packaged by solder joint by supplying a proper quantity of solder additionally to each solder bump 16a. COPYRIGHT: (C)2008,JPO&INPIT |
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SOLUTION: When an electronic component 16 having a plurality of solder bumps 16a formed on the lower surface is packaged on a substrate, the electronic component mounting device reads out the paste transfer information including the component warpage information indicative of the state of warpage of the electronic component in the reflow process from a library and forms a coating 7a having a film thickness distribution for transferring a desired amount of solder paste to each of a plurality of solder bumps depending on the state of warpage on a paste transfer unit 24 based on the library data thus read out. Consequently, poor joint can be prevented when an easy-to-warp electronic component is packaged by solder joint by supplying a proper quantity of solder additionally to each solder bump 16a. 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SOLUTION: When an electronic component 16 having a plurality of solder bumps 16a formed on the lower surface is packaged on a substrate, the electronic component mounting device reads out the paste transfer information including the component warpage information indicative of the state of warpage of the electronic component in the reflow process from a library and forms a coating 7a having a film thickness distribution for transferring a desired amount of solder paste to each of a plurality of solder bumps depending on the state of warpage on a paste transfer unit 24 based on the library data thus read out. Consequently, poor joint can be prevented when an easy-to-warp electronic component is packaged by solder joint by supplying a proper quantity of solder additionally to each solder bump 16a. 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SOLUTION: When an electronic component 16 having a plurality of solder bumps 16a formed on the lower surface is packaged on a substrate, the electronic component mounting device reads out the paste transfer information including the component warpage information indicative of the state of warpage of the electronic component in the reflow process from a library and forms a coating 7a having a film thickness distribution for transferring a desired amount of solder paste to each of a plurality of solder bumps depending on the state of warpage on a paste transfer unit 24 based on the library data thus read out. Consequently, poor joint can be prevented when an easy-to-warp electronic component is packaged by solder joint by supplying a proper quantity of solder additionally to each solder bump 16a. COPYRIGHT: (C)2008,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING MACHINES OR PRESSES SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS |
| title | ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT PACKAGING METHOD |
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