METHOD FOR FORMING COMPLIANT INTERFACE OF SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To provide a compliant interface for coping with a discordance between the thermal expansion coefficients of a semiconductor chip and of a support structure, such as printed wiring board. SOLUTION: This method for forming a compliant interface of a semiconductor chip comprises processes of providing a first support structure 100 having a first face, a second face, a plurality of terminals 140 on the second face and a porous elastic layer disposed on the first face of the first supporting structure; butting a first face of a second supporting structure 120 to the porous layer so that the porous elastic layer is arranged between the first and second support structures and the first support structure is separated from the second support structure; arranging a first curable liquid within the porous layer after the butting process so that the first curable liquid is arranged between the first and second support structures; and substantially matching coplanarly a plurality of terminals to each other, by making a plurality of the terminals engage to a platen. COPYRIGHT: (C)2008,JPO&INPIT