PACKAGING STRUCTURE HAVING THREE-DIMENSIONAL WIRING

PROBLEM TO BE SOLVED: To solve the problems that an element requiring surface space cannot be miniaturized fully, and the degree of freedom in design cannot be secured fully for a wafer-level miniaturization packaging technique of the element requiring the space on the surface of an SAW (Surface Acoustic Wave) filter, a BAW (Bulk Acoustic Wave) filter, an MEMS (Micro-Electro-Mechanical Systems), or the like; and working hours are needed since the element is divided into individual pieces for assembly. SOLUTION: An element member having a spatially movable portion provided on a substrate for packaging is arranged at a space held by an organic insulating resin layer at a portion to the substrate for packaging, and at least a multilayer wiring is arranged in the organic insulating resin layer. By adopting such a structure, the space is secured and the wiring can be miniaturized as much as possible for arrangement. COPYRIGHT: (C)2008,JPO&INPIT