THERMALLY CONDUCTIVE COMPOSITE ARTICLE

PROBLEM TO BE SOLVED: To provide a material excellent in compressibility and thermal conductivity, suitable for use as a boundary material for effectively dissipating heat generated from constituent parts of an integrated circuit. SOLUTION: The composite article comprises thermally conductive partic...

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Bibliographische Detailangaben
1. Verfasser:	HANRAHAN JAMES R
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a material excellent in compressibility and thermal conductivity, suitable for use as a boundary material for effectively dissipating heat generated from constituent parts of an integrated circuit. SOLUTION: The composite article comprises thermally conductive particles and hollow polymer particles non-electroconductive, expandable by energy and has a polytetrafluoroethylene matrix. Preferably, the thermally conductive particles are selected from a metal, a metal oxide, metal powder, metal beads, metal fibers, metal-coated fibers, metal flakes, a metal-coated metal and further contains a silicone elastomer material. The silicone elastomer material is laid in the composite article in a discontinuous state. Preferably, the composite article has less than 1.5 g/cc of density and