MANUFACTURING METHOD OF CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board capable of reducing the failure of insulated breakdown voltage between adjoining wiring, while materializing the microfabrication of the processing size of wiring. SOLUTION: An insulating layer 3 is formed on a board 1. Next,...
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| creator | MIZUHARA HIDEKI NAKAZATO MAYUMI |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board capable of reducing the failure of insulated breakdown voltage between adjoining wiring, while materializing the microfabrication of the processing size of wiring. SOLUTION: An insulating layer 3 is formed on a board 1. Next, a conductor 4a and a conductor 4b adjoining the conductor 4a are formed on the surface of the insulating layer 3, and at least a side surface of the upper part of the conductor 4a and the conductor 4b is processed into a forward tapered shape profile. Then, by press fitting the conductor 4a and the conductor 4b into the insulating layer 3, the conductor 4a and the conductor 4b are arranged into the insulating layer 3 in a self-adjusting way. Consequently, the insulating layer 3 is formed between the conductor 4a and the conductor 4b having a convex shape 3a, and also a region 5 which does not come into contact with the insulating layer 3 is formed in the side of the conductor 4a (the side of the conductor 4b). COPYRIGHT: (C)2008,JPO&INPIT |
| format | Patent |
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SOLUTION: An insulating layer 3 is formed on a board 1. Next, a conductor 4a and a conductor 4b adjoining the conductor 4a are formed on the surface of the insulating layer 3, and at least a side surface of the upper part of the conductor 4a and the conductor 4b is processed into a forward tapered shape profile. Then, by press fitting the conductor 4a and the conductor 4b into the insulating layer 3, the conductor 4a and the conductor 4b are arranged into the insulating layer 3 in a self-adjusting way. Consequently, the insulating layer 3 is formed between the conductor 4a and the conductor 4b having a convex shape 3a, and also a region 5 which does not come into contact with the insulating layer 3 is formed in the side of the conductor 4a (the side of the conductor 4b). 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | MANUFACTURING METHOD OF CIRCUIT BOARD |
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