METHOD FOR FORMING CIRCUIT PATTERN

METHOD FOR FORMING CIRCUIT PATTERN

PROBLEM TO BE SOLVED: To form a metallic film on a base, and to require an etching process in order to form a circuit pattern by using an inprint technology or a photolithography technology. SOLUTION: The rays of light are irradiated to the back face of a transparent substrate 3 on which an inprint...

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Bibliographische Detailangaben
1. Verfasser: TANIGUCHI YUZO
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To form a metallic film on a base, and to require an etching process in order to form a circuit pattern by using an inprint technology or a photolithography technology. SOLUTION: The rays of light are irradiated to the back face of a transparent substrate 3 on which an inprint resin pattern 8 is formed, and a conductor pattern (optical CVD film pattern 6) is selectively formed only in a concave section of the resin pattern 8 by an optical CVD method. In the resin pattern 8 part, the rays of light irradiated to the back face of the substrate are absorbed or shielded so that any optical CVD reaction can be prevented from being generated. COPYRIGHT: (C)2008,JPO&INPIT