MULTILAYER SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENTS AND ELECTRONIC EQUIPMENT
PROBLEM TO BE SOLVED: To easily replace or change the quantity of built-in electronic components. SOLUTION: A multilayer substrate 26 with built-in electronic components consists of a first printed circuit board 40, a second printed circuit board 42 and an ACF 44. A countersunk hole 46 is formed in...
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| creator | IWATA HISAYA |
| description | PROBLEM TO BE SOLVED: To easily replace or change the quantity of built-in electronic components. SOLUTION: A multilayer substrate 26 with built-in electronic components consists of a first printed circuit board 40, a second printed circuit board 42 and an ACF 44. A countersunk hole 46 is formed in a first facing surface 40a of the first printed circuit board 40. A DSP 34 is provided in the countersunk hole 46. First contact terminals 48 are also provided in the countersunk hole 46. Second contact terminals 50 are provided on a second facing surface 42a of the second printed circuit board 42. The printed circuit boards 40 and 42 are thermocompression bonded to each other with the ACF 44 sandwiched therebetween so as to join the printed circuit boards 40 and 42 to each other and to electrically connect the first contact terminals 48 to the second contact terminals 50. Since the printed circuit boards 40 and 42 are joined to each other with the ACF 44 sandwiched therebetween, reheating can separate the printed circuit boards 40 and 42 from each other to expose the countersunk hole 46, thereby making possible to easily replace or change the quantity of the built-in DSP 34. COPYRIGHT: (C)2008,JPO&INPIT |
| format | Patent |
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SOLUTION: A multilayer substrate 26 with built-in electronic components consists of a first printed circuit board 40, a second printed circuit board 42 and an ACF 44. A countersunk hole 46 is formed in a first facing surface 40a of the first printed circuit board 40. A DSP 34 is provided in the countersunk hole 46. First contact terminals 48 are also provided in the countersunk hole 46. Second contact terminals 50 are provided on a second facing surface 42a of the second printed circuit board 42. The printed circuit boards 40 and 42 are thermocompression bonded to each other with the ACF 44 sandwiched therebetween so as to join the printed circuit boards 40 and 42 to each other and to electrically connect the first contact terminals 48 to the second contact terminals 50. Since the printed circuit boards 40 and 42 are joined to each other with the ACF 44 sandwiched therebetween, reheating can separate the printed circuit boards 40 and 42 from each other to expose the countersunk hole 46, thereby making possible to easily replace or change the quantity of the built-in DSP 34. COPYRIGHT: (C)2008,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | MULTILAYER SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENTS AND ELECTRONIC EQUIPMENT |
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