MOTHERBOARD PROCESSING DIE, METHOD FOR MANUFACTURING PROCESSING BOARD, AND METHOD FOR MANUFACTURING PRODUCT BOARD
PROBLEM TO BE SOLVED: To provide a motherboard processing die capable of simultaneously performing the push-back processing of a printed circuit board and the outer shape cutting processing of a frame without enlarging the die, and capable of easily separating a mounting board; and to provide a meth...
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| creator | IWAMOTO KATSUHIKO |
| description | PROBLEM TO BE SOLVED: To provide a motherboard processing die capable of simultaneously performing the push-back processing of a printed circuit board and the outer shape cutting processing of a frame without enlarging the die, and capable of easily separating a mounting board; and to provide a method for manufacturing a processing board and a method for manufacturing a product board. SOLUTION: The motherboard processing die 10 is provided with a first area 12 for performing the push-back of a first product board from a motherboard and the push-back of a frame for supporting the product board. The first area 12 is provided with first push-back means 26, 64 for punching the first product board from the motherboard, and fitting the punched first product board into the original hole; and second push-back means 24, 62 for punching the frame from the motherboard in the reverse direction against the first product board, and fitting the punched frame part into the original hole. The motherboard processing die 10 is used for the method for manufacturing the processing board and the method for manufacturing the product board. COPYRIGHT: (C)2008,JPO&INPIT |
| format | Patent |
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SOLUTION: The motherboard processing die 10 is provided with a first area 12 for performing the push-back of a first product board from a motherboard and the push-back of a frame for supporting the product board. The first area 12 is provided with first push-back means 26, 64 for punching the first product board from the motherboard, and fitting the punched first product board into the original hole; and second push-back means 24, 62 for punching the frame from the motherboard in the reverse direction against the first product board, and fitting the punched frame part into the original hole. The motherboard processing die 10 is used for the method for manufacturing the processing board and the method for manufacturing the product board. COPYRIGHT: (C)2008,JPO&INPIT</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CUTTING ; CUTTING-OUT ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HAND CUTTING TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORATING ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PUNCHING ; SEVERING ; SEVERING BY MEANS OTHER THAN CUTTING ; STAMPING-OUT ; TRANSPORTING</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071206&DB=EPODOC&CC=JP&NR=2007318052A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071206&DB=EPODOC&CC=JP&NR=2007318052A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IWAMOTO KATSUHIKO</creatorcontrib><title>MOTHERBOARD PROCESSING DIE, METHOD FOR MANUFACTURING PROCESSING BOARD, AND METHOD FOR MANUFACTURING PRODUCT BOARD</title><description>PROBLEM TO BE SOLVED: To provide a motherboard processing die capable of simultaneously performing the push-back processing of a printed circuit board and the outer shape cutting processing of a frame without enlarging the die, and capable of easily separating a mounting board; and to provide a method for manufacturing a processing board and a method for manufacturing a product board. SOLUTION: The motherboard processing die 10 is provided with a first area 12 for performing the push-back of a first product board from a motherboard and the push-back of a frame for supporting the product board. The first area 12 is provided with first push-back means 26, 64 for punching the first product board from the motherboard, and fitting the punched first product board into the original hole; and second push-back means 24, 62 for punching the frame from the motherboard in the reverse direction against the first product board, and fitting the punched frame part into the original hole. The motherboard processing die 10 is used for the method for manufacturing the processing board and the method for manufacturing the product board. 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SOLUTION: The motherboard processing die 10 is provided with a first area 12 for performing the push-back of a first product board from a motherboard and the push-back of a frame for supporting the product board. The first area 12 is provided with first push-back means 26, 64 for punching the first product board from the motherboard, and fitting the punched first product board into the original hole; and second push-back means 24, 62 for punching the frame from the motherboard in the reverse direction against the first product board, and fitting the punched frame part into the original hole. The motherboard processing die 10 is used for the method for manufacturing the processing board and the method for manufacturing the product board. COPYRIGHT: (C)2008,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JP2007318052A |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CUTTING CUTTING-OUT ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CUTTING TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORATING PERFORMING OPERATIONS PRINTED CIRCUITS PUNCHING SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TRANSPORTING |
| title | MOTHERBOARD PROCESSING DIE, METHOD FOR MANUFACTURING PROCESSING BOARD, AND METHOD FOR MANUFACTURING PRODUCT BOARD |
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