SOLDER TUB AND SOLDERING EQUIPMENT

PROBLEM TO BE SOLVED: To provide a solder tub and soldering equipment that excel in corrosion resistance against fused solder more than conventional ones. SOLUTION: The solder tub includes a metallic container for storing fused solder and an amorphous carbon film which is formed on the inner face of...

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Hauptverfasser: YOSHIOKA TAKAYASU, TACHIKAWA HIDEO, HASEGAWA HIDEO, KAJINO MASAKI
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Sprache:eng
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creator YOSHIOKA TAKAYASU
TACHIKAWA HIDEO
HASEGAWA HIDEO
KAJINO MASAKI
description PROBLEM TO BE SOLVED: To provide a solder tub and soldering equipment that excel in corrosion resistance against fused solder more than conventional ones. SOLUTION: The solder tub includes a metallic container for storing fused solder and an amorphous carbon film which is formed on the inner face of the container and which contains one or more kinds of elements to be added selectable from semiconductors and metals. Also, the soldering equipment is at least provided with the solder tub and a holding means that holds a member to be soldered and that moves it so that its part to be soldered is immersed in the fused solder stored in the container. The solder tub and the soldering equipment have the amorphous carbon film containing the additional element(s) on the surface of the container as a corrosion resistant film that comes in contact with the fused solder, and particularly have a superior corrosion resistance against lead-free solder. COPYRIGHT: (C)2008,JPO&INPIT
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2007283331A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2007283331A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2007283331A3</originalsourceid><addsrcrecordid>eNrjZFAK9vdxcQ1SCAl1UnD0c1GAcD393BVcA0M9A3xd_UJ4GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8V4CRgYG5kYWxsbGhozFRigB5XiLd</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SOLDER TUB AND SOLDERING EQUIPMENT</title><source>esp@cenet</source><creator>YOSHIOKA TAKAYASU ; TACHIKAWA HIDEO ; HASEGAWA HIDEO ; KAJINO MASAKI</creator><creatorcontrib>YOSHIOKA TAKAYASU ; TACHIKAWA HIDEO ; HASEGAWA HIDEO ; KAJINO MASAKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a solder tub and soldering equipment that excel in corrosion resistance against fused solder more than conventional ones. SOLUTION: The solder tub includes a metallic container for storing fused solder and an amorphous carbon film which is formed on the inner face of the container and which contains one or more kinds of elements to be added selectable from semiconductors and metals. Also, the soldering equipment is at least provided with the solder tub and a holding means that holds a member to be soldered and that moves it so that its part to be soldered is immersed in the fused solder stored in the container. The solder tub and the soldering equipment have the amorphous carbon film containing the additional element(s) on the surface of the container as a corrosion resistant film that comes in contact with the fused solder, and particularly have a superior corrosion resistance against lead-free solder. COPYRIGHT: (C)2008,JPO&amp;INPIT</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20071101&amp;DB=EPODOC&amp;CC=JP&amp;NR=2007283331A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20071101&amp;DB=EPODOC&amp;CC=JP&amp;NR=2007283331A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIOKA TAKAYASU</creatorcontrib><creatorcontrib>TACHIKAWA HIDEO</creatorcontrib><creatorcontrib>HASEGAWA HIDEO</creatorcontrib><creatorcontrib>KAJINO MASAKI</creatorcontrib><title>SOLDER TUB AND SOLDERING EQUIPMENT</title><description>PROBLEM TO BE SOLVED: To provide a solder tub and soldering equipment that excel in corrosion resistance against fused solder more than conventional ones. SOLUTION: The solder tub includes a metallic container for storing fused solder and an amorphous carbon film which is formed on the inner face of the container and which contains one or more kinds of elements to be added selectable from semiconductors and metals. Also, the soldering equipment is at least provided with the solder tub and a holding means that holds a member to be soldered and that moves it so that its part to be soldered is immersed in the fused solder stored in the container. The solder tub and the soldering equipment have the amorphous carbon film containing the additional element(s) on the surface of the container as a corrosion resistant film that comes in contact with the fused solder, and particularly have a superior corrosion resistance against lead-free solder. COPYRIGHT: (C)2008,JPO&amp;INPIT</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAK9vdxcQ1SCAl1UnD0c1GAcD393BVcA0M9A3xd_UJ4GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8V4CRgYG5kYWxsbGhozFRigB5XiLd</recordid><startdate>20071101</startdate><enddate>20071101</enddate><creator>YOSHIOKA TAKAYASU</creator><creator>TACHIKAWA HIDEO</creator><creator>HASEGAWA HIDEO</creator><creator>KAJINO MASAKI</creator><scope>EVB</scope></search><sort><creationdate>20071101</creationdate><title>SOLDER TUB AND SOLDERING EQUIPMENT</title><author>YOSHIOKA TAKAYASU ; TACHIKAWA HIDEO ; HASEGAWA HIDEO ; KAJINO MASAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2007283331A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIOKA TAKAYASU</creatorcontrib><creatorcontrib>TACHIKAWA HIDEO</creatorcontrib><creatorcontrib>HASEGAWA HIDEO</creatorcontrib><creatorcontrib>KAJINO MASAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIOKA TAKAYASU</au><au>TACHIKAWA HIDEO</au><au>HASEGAWA HIDEO</au><au>KAJINO MASAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLDER TUB AND SOLDERING EQUIPMENT</title><date>2007-11-01</date><risdate>2007</risdate><abstract>PROBLEM TO BE SOLVED: To provide a solder tub and soldering equipment that excel in corrosion resistance against fused solder more than conventional ones. SOLUTION: The solder tub includes a metallic container for storing fused solder and an amorphous carbon film which is formed on the inner face of the container and which contains one or more kinds of elements to be added selectable from semiconductors and metals. Also, the soldering equipment is at least provided with the solder tub and a holding means that holds a member to be soldered and that moves it so that its part to be soldered is immersed in the fused solder stored in the container. The solder tub and the soldering equipment have the amorphous carbon film containing the additional element(s) on the surface of the container as a corrosion resistant film that comes in contact with the fused solder, and particularly have a superior corrosion resistance against lead-free solder. COPYRIGHT: (C)2008,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title SOLDER TUB AND SOLDERING EQUIPMENT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T11%3A31%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YOSHIOKA%20TAKAYASU&rft.date=2007-11-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2007283331A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true